was established at LASEROPTIK after a two year joint r&d effort with US engineering experts. As a result LASEROPTIK were the first using a unique sputtering technology in October 2001, that is best described like this*:
"In a magnetron sputter system, there are cathode assemblies containing magnets. The face of these cathodes has a plate of coating material called a target. After the coating chamber is evacuated, it is backfilled with a working gas, typically argon. A voltage is applied to the cathode assembly. The electrons are contained in front of the cathode by the magnetic field. As electrons hit the argon atoms, the electrons are knocked off the argon atoms, causing them to become positively charged. A plasma of ionized argon forms in front of the target. The positively charged argon ions are accelerated toward the negatively charged target, where they strike the face of the target-ejecting metal atoms.
During this process, a reactive gas, typically oxygen or nitrogen, is introduced. The gas combines with the metal atoms from the target to form the desired metal oxide or nitride. Typically, the material sources, or targets, are around the periphery of the chamber, and the substrates are held on the surface of the drum in the center. The drum rotates so all parts are coated."
Please feel free to contact our sputtering specialist directly:
Martin Ebert email@example.com , Tel.: +49 5131 4597-30